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MADP-064908-131000 Datasheet (PDF) - Tyco Electronics

MADP-064908-131000 Datasheet PDF - Tyco Electronics
Part # MADP-064908-131000
Download  MADP-064908-131000 Download

File Size   511.08 Kbytes
Page   9 Pages
Manufacturer  MACOM [Tyco Electronics]
Direct Link  http://www.macom.com
Logo MACOM - Tyco Electronics
Description Surface Mount Monolithic Integrated PIN Diode Chip

MADP-064908-131000 Datasheet (PDF)

Go To PDF Page Download Datasheet
MADP-064908-131000 Datasheet PDF - Tyco Electronics

Part # MADP-064908-131000
Download  MADP-064908-131000 Click to download

File Size   511.08 Kbytes
Page   9 Pages
Manufacturer  MACOM [Tyco Electronics]
Direct Link  http://www.macom.com
Logo MACOM - Tyco Electronics
Description Surface Mount Monolithic Integrated PIN Diode Chip

MADP-064908-131000 Datasheet (HTML) - Tyco Electronics

MADP-064908-131000 Datasheet HTML 1Page - Tyco Electronics MADP-064908-131000 Datasheet HTML 2Page - Tyco Electronics MADP-064908-131000 Datasheet HTML 3Page - Tyco Electronics MADP-064908-131000 Datasheet HTML 4Page - Tyco Electronics MADP-064908-131000 Datasheet HTML 5Page - Tyco Electronics MADP-064908-131000 Datasheet HTML 6Page - Tyco Electronics MADP-064908-131000 Datasheet HTML 7Page - Tyco Electronics MADP-064908-131000 Datasheet HTML 8Page - Tyco Electronics MADP-064908-131000 Datasheet HTML 9Page - Tyco Electronics

MADP-064908-131000 Product details

Description and Applications
This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMIC process. This 8.0 µm I-region length device features 6 silicon pedestals embedded in a low loss, low dispersion glass. The diodes are formed on the top of a pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. The vertical Silicon Diode topology provides for a highly efficient heat transfer medium.

Features
• No Wirebonds Required
• Rugged Silicon-Glass Construction
• Silicon Nitride Passivation & Polymer Scratch
   Protection
• Ultra-Low Parasitic Capacitance and Inductance
• Higher RF C.W. Power Handling
• Better Performance than Alternative Packaged
   Devices




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About Tyco Electronics


Tyco Electronics was a leading provider of electronic components, network solutions, and wireless systems. The company was originally established in 1999 as Tyco International and was later renamed Tyco Electronics in 2007. Tyco Electronics had a global presence, with operations in over 50 countries and a workforce of approximately 20,000 employees.

The company provided a wide range of products and services, including connectors, relays, power management solutions, circuit protection devices, and other electronic components for a variety of industries, including automotive, communications, medical, industrial, and consumer electronics. Tyco Electronics was known for its focus on quality, reliability, and innovation, and was recognized as a leader in the electronics industry.

In 2012, Tyco Electronics was acquired by TE Connectivity, a leading provider of connectivity and sensor solutions. The acquisition helped TE Connectivity expand its product portfolio and offerings in the electronics industry and further strengthen its position in the market. Tyco Electronics is now a subsidiary of TE Connectivity and continues to provide high-quality products and services to its customers.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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