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AE-3192-17A501 Datasheet (PDF) - Molex Electronics Ltd.

AE-3192-17A501 Datasheet PDF - Molex Electronics Ltd.
Part # AE-3192-17A501
Download  AE-3192-17A501 Download

File Size   87.26 Kbytes
Page   3 Pages
Manufacturer  MOLEX3 [Molex Electronics Ltd.]
Direct Link  http://www.molex.com
Logo MOLEX3 - Molex Electronics Ltd.
Description 3.96mm (.156") Pitch KK짰 Wire-to-Board Header, Vertical Round Pin, 17 Circuits, Gold (Au) Plating, with Mating Pin Length of 11.43mm (.450")

AE-3192-17A501 Datasheet (PDF)

Go To PDF Page Download Datasheet
AE-3192-17A501 Datasheet PDF - Molex Electronics Ltd.

Part # AE-3192-17A501
Download  AE-3192-17A501 Click to download

File Size   87.26 Kbytes
Page   3 Pages
Manufacturer  MOLEX3 [Molex Electronics Ltd.]
Direct Link  http://www.molex.com
Logo MOLEX3 - Molex Electronics Ltd.
Description 3.96mm (.156") Pitch KK짰 Wire-to-Board Header, Vertical Round Pin, 17 Circuits, Gold (Au) Plating, with Mating Pin Length of 11.43mm (.450")

AE-3192-17A501 Datasheet (HTML) - Molex Electronics Ltd.

AE-3192-17A501 Datasheet HTML 1Page - Molex Electronics Ltd. AE-3192-17A501 Datasheet HTML 2Page - Molex Electronics Ltd. AE-3192-17A501 Datasheet HTML 3Page - Molex Electronics Ltd.



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About Molex Electronics Ltd.


Molex Electronics Ltd. is a subsidiary of Koch Industries, Inc., and is a global manufacturer of electronic and fiber optic interconnect solutions.

The company was founded in 1938 and is headquartered in Lisle, Illinois.

Molex offers a wide range of interconnect products including connectors, cable assemblies, switches, and other passive components.

These products are used in various industries including automotive, data communications, consumer electronics, industrial equipment, medical devices, and telecommunications.

With operations and facilities in over 40 countries, Molex is known for its innovation and technology leadership in the interconnect solutions market.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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