| Electronic Components Datasheet Search |
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ENCAPSULATION Datasheet, PDF |
| Searched Keyword : 'ENCAPSULATION' - Total: 67 (1/4) Pages |
| Manufacturer | Part # | Datasheet | Description |
|
PANDUIT CORP. |
D-300-01 | 131Kb/7P |
CAP, SPLICE ENCAPSULATION |
| D-300-08 | 76Kb/7P |
CAP, SPLICE ENCAPSULATION | |
|
Hitachi Semiconductor |
DNA1002D | 50Kb/1P |
HITACHI Encapsulation, DIP 16 |
|
List of Unclassifed Man... |
SM2615FTR845 | 131Kb/2P |
High temperature molded encapsulation |
| ATC900C | 182Kb/6P |
Available with Encapsulation Option | |
|
MPS Industries, Inc. |
R7X1210M | 160Kb/1P |
ENCAPSULATION MOLDED CHIP INDUCTOR |
|
Vishay Siliconix |
WSRHP | 103Kb/4P |
Molded high temperature encapsulation Revision: 21-Oct-16 |
|
List of Unclassifed Man... |
SM6227FT1R00 | 131Kb/2P |
High temperature molded encapsulation |
|
MPS Industries, Inc. |
R7X1008M | 160Kb/1P |
ENCAPSULATION MOLDED CHIP INDUCTOR |
|
List of Unclassifed Man... |
SM6227JT62R0 | 130Kb/2P |
High temperature molded encapsulation |
|
M.S. Kennedy Corporatio... |
MSK4890 | 604Kb/5P |
Proprietary Encapsulation Provides Near Hermetic Performance |
| MSK4891 | 363Kb/5P |
Proprietary Encapsulation Provides Near Hermetic Performance | |
|
Vishay Siliconix |
WSCWSN | 101Kb/3P |
All welded construction, Molded encapsulation, Wraparound terminations Revision: 17-Feb-11 |
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KODENSHI_AUK CORP. |
SP217 | 153Kb/3P |
TO-5 type header with clear epoxy encapsulation |
|
AVAGO TECHNOLOGIES LIMI... |
ASMT-QWBF-NKL0E | 131Kb/10P |
High reliability package with enhanced silicone resin encapsulation |
| ASMT-QYBG | 182Kb/9P |
High reliability package with enhanced silicone resin encapsulation | |
| ASMT-UYBG | 181Kb/10P |
High reliability package with enhanced silicone resin encapsulation | |
| ASMT-JB11-NMP01 | 72Kb/2P |
Silicone Encapsulation for LED Advantages and Handling Precautions | |
| ASMT-UWBG | 181Kb/10P |
High reliability package with enhanced silicone resin encapsulation | |
|
Sangdest Microelectroni... |
209CNQ | 140Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and |
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