| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0741620414 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 14 Circuits, 0.8關m (30關") Gold (Au) |
| 0741620450 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 50 Circuits, 0.8關m (30關") Gold (Au |
| 0743209124 |
199Kb/4P |
MicroCross??DVI-D Digital Interface with EMI Shielding, PCB Receptacle, PanelMount, Through Hole, Right Angle, 0.76關m (30關") Gold (Au) Plating,2.34mm (.092") |
| 0741620422 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 22 Circuits, 0.8關m (30關") Gold (Au) |
| 0741620420 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 20 Circuits, 0.8關m (30關") Gold (Au) |
| 0741620462 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 62 Circuits, 0.8關m (30關") Gold (Au |
| 0743232112 |
453Kb/5P |
MicroCross??DVI Analog, High Volume Plug Connector Sub-assembly, for PCB Mount, Vertical, 0.76關m (30關") Gold (Au) Plating, 23 Circuits, Lead Free |
| 0717640120 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0740571002 |
280Kb/5P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Header, Vertical, 6-RowOpen Signal Module, 60 Circuits, 10 Columns, Pin Length 6.25mm (.246"), 0.76關m |
| 0714390564 |
325Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Embossed Tape on Reel, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0717640226 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0741620230 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 30 Circuits, 0.4關m (15關") Gold (Au |
| 0717640210 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 10 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0741620224 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 24 Circuits, 0.4關m (15關") Gold (Au) |
| 0741620412 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 12 Circuits, 0.8關m (30關") Gold (Au |
| 0741620256 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 56 Circuits, 0.4關m (15關") Gold (Au |
| 0717640216 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0741620416 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 16 Circuits, 0.8關m (30關") Gold (Au |
| 0717640222 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, DualRow, Right Angle,High Temperature, 22 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0741620440 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 40 Circuits, 0.8關m (30關") Gold (Au |
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