| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0741621208 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 8 Circuits, 0.4關m (15關") Gold (Au |
| 0717640108 |
131Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0678380806 |
446Kb/6P |
Stacked Modular Jack with lightpipes, Right Angle, with Press-Fit Pegs, with Side PanelGrounding Tabs and Inner Shield Ground Tabs, 8/2, 16 Ports, Lead free |
| 0746512602 |
372Kb/4P |
2.00mm (.079") Pitch 8-Row VHDM-HSD??Backplane Header, Guide Pin Signal Module, Shield Pin End Version, Advanced Mate Shield, 150 Circuits, Pin Length 6.25mm (.246") |
| 0740621003 |
528Kb/4P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 80 Circuits, Pin Length |
| 0746502612 |
397Kb/4P |
2.00mm (.079") Pitch 8-Row VHDM-HSD??Backplane Header, Guide Pin Signal Module, Signal Pin End Version, Advanced Mate Shield, 150 Circuits, Pin Length 6.25mm (.246") |
| 0705510077 |
310Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Beveled Plastic Peg, 8 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin |
| 0740619021 |
513Kb/4P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, Lead Free, 80 Circuits, Pin Length 4.75mm (.187") |
| 0740298400 |
237Kb/4P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Receptacle Power Module,Vertical, 8-Row, 2 Circuits, Pin 2 Voided, Gold (Au) Selective 0.76關m (30關") |
| 0702871149 |
314Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 8.13mm (.320") Mating Pin Length, 0.38關m (15關") Gold (Au) Selective |
| 0702871100 |
319Kb/6P |
2.54mm (.100") Pitch C-Grid짰 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 6.10mm (.240") Mating Pin Length, 0.38關m (15關") Gold (Au) Selective |
| 0702871198 |
319Kb/6P |
2.54mm (.100") Pitch C-Grid짰 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 6.10mm (.240") Mating Pin Length, 0.76關m (30關") Gold (Au) Selective |
| 0740619004 |
507Kb/4P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, Lead Free, 80 Circuits, Pin Length 5.15mm (.203") |
| 0702871247 |
314Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 8.13mm (.320") Mating Pin Length, 0.76關m (30關") Gold (Au) Selective |
| 0705750042 |
261Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Right Angle, .180" Pocket, Shroudedwith Press-fit Plastic Peg, 8 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin |
| 0741640008 |
403Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row, Shrouded with Pegs, Version A, High-Temperature, 8 Circuits, 0.4關m (15關") Gold (Au) |
| 0705410042 |
201Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, withBeveled Plastic Peg, 8 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC |
| 0713491036 |
433Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, Shrouded, 8 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0705530112 |
359Kb/5P |
2.54mm (.100") Pitch SL??Header, Low Profile, Single Row, Right Angle, .120" PocketShrouded, 8 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail |
| 0705419042 |
167Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, withStraight Plastic Peg, 8 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC |
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