| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd.
|
0850030646 |
99Kb/3P |
2.54mm (.100") Pitch DIN 41612 Header, Right Angle, Through Hole, Style C, 0.6關m (24關") Selective Gold (Au), 64 Circuits, Lead free |
| 0753417466 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0753310764 |
339Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 3-Pair GbX짰 Backplane Connector System, Power Module, 6 Circuits, 1.27關m (50關") Gold (Au) |
| 0850030191 |
89Kb/3P |
2.54mm (.100") Pitch DIN 41612 Header, Style C, Right Angle, Through Hole, 0.6關m(24關") Selective Gold (Au), 96 Circuits, Lead free |
| 0876682002 |
203Kb/4P |
6.35mm (.250") Pitch, Power, 2.54mm (.100") Pitch, Signal, EXTreme PowerPlus??SPbReceptacle, Through Hole, Right Angle, Beveled Metal Pins, 0.76關m (30關") Gold |
| 0877159901 |
143Kb/3P |
Phosphor Bronze, 0.38關m (15關") Gold (Au) Plating, with Plastic Pegs, 2.54mm (.100")Soldertail, PCB Thickness 1.58mm (.062"), 26 Circuits, Lead Free |
| 0753416647 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753417467 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753417464 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753413333 |
317Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0850030206 |
86Kb/3P |
2.54mm (.100) Pitch DIN 41612 Header, Style C, Right Angle, Through Hole, 0.6關m (24關) Selective Gold (Au), 96 Circuits, Lead free |
| 0791077214 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating |
| 0753414766 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753416646 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0877580450 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0757840119 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.76關m (30關) Gold (Au), Retention Shell, Left Key |
| 0753426777 |
316Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 16 Circuits, 1.27關m (50關) Gold (Au) |
| 0850133122 |
140Kb/5P |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1關m (40關) Selective Gold (Au), 96 Circuits, Lead free |
| 0753417447 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0757840108 |
1Mb/14P |
0.80mm (.031) Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36 Circuit, 0.38關m (15關) Gold (Au), Retention Shell, Right Key |
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