| Manufacturer | Part # | Datasheet | Description |

Molex Electronics Ltd.
|
0887328712 |
187Kb/3P |
USB On-The-Go (OTG) Shielded I/O Cable Assembly, USB A-to-Mini B, USB 1.1, 1.50m (4.92) Length, Black |
| 0010021022 |
150Kb/3P |
5.08mm (.200") Pitch KK짰 PC Board Connector, Bottom Entry Mount Style B, 1.0關m (40關") Tin (Sn), 2 Circuits |
| 0010021102 |
150Kb/3P |
5.08mm (.200") Pitch KK짰 PC Board Connector, Bottom Entry Mount Style B, 1.0關m (40關") Tin (Sn), 10 Circuits |
| 0010021072 |
150Kb/3P |
5.08mm (.200") Pitch KK짰 PC Board Connector, Bottom Entry Mount Style B, 1.0關m (40關") Tin (Sn), 7 Circuits |
| 0010021052 |
150Kb/3P |
5.08mm (.200") Pitch KK짰 PC Board Connector, Bottom Entry Mount Style B, 1.0關m (40關") Tin (Sn), 5 Circuits |
| 0346750002 |
215Kb/2P |
5.00mm (.197") Pitch MX150??2 Way Inline Male Assembly with TPA, Single Row, 2Circuits, Keying Option B, without Clip Slot, Gray |
| 0334724002 |
52Kb/1P |
MX150 Sealed Female Connector, Dual Row, 4 Circuits, Polarization B, without Connector Position Assurance, with Open Standard Grommet Cap, Light Gray |

List of Unclassifed Man...
|
79696037 |
260Kb/4P |
Pt100 probe Class B - Aluminium vee : 50 mm long - Silicom teflon cable : 2 m long - 3-wire assembly - Supplied with fixing |

Molex Electronics Ltd.
|
0934445521 |
41Kb/1P |
ML-XT Sealed 8 Circuit Receptacle Housing with Heatshrink, Pre-Assembled with Small Rear Seal and Cover, Keying Option B, Black |
| 0934455521 |
44Kb/1P |
ML-XT Sealed 8 Circuit Plug Housing with Heatshrink, Pre-Assembled with Small Rear Seal and Cover, Keying Option B, Black |
| 0934455621 |
44Kb/1P |
ML-XT Sealed 8 Circuit Plug Housing with Heatshrink, Pre-Assembled with Large Rear Seal and Cover, Keying Option B, Black |

Taiyo Yuden (U.S.A.), I...
|
MLAST021SCG040BWNA01 |
431Kb/3P |
Multilayer Ceramic Capacitors (Temperature compensating type) for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II) 22CDD09 |
| MLAST021SCG050BWNA01 |
431Kb/3P |
Multilayer Ceramic Capacitors (Temperature compensating type) for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II) 22CDD09 |
| MLAST021SCG060CWNA01 |
431Kb/3P |
Multilayer Ceramic Capacitors (Temperature compensating type) for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II) 22CDD09 |
| MLAST021SCG070DWNA01 |
431Kb/3P |
Multilayer Ceramic Capacitors (Temperature compensating type) for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II) 22CDD09 |
| MLAST021SCG080CWNA01 |
431Kb/3P |
Multilayer Ceramic Capacitors (Temperature compensating type) for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II) 22CDD09 |
| MLASE021SB5221KWNA01 |
432Kb/3P |
Multilayer Ceramic Capacitors (High dielectric type) for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II) 22SA09 |
| MLASE021SCG330JWNA01 |
431Kb/3P |
Multilayer Ceramic Capacitors (Temperature compensating type) for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II) 22CMD09 |
| MLASE021SCG390JWNA01 |
431Kb/3P |
Multilayer Ceramic Capacitors (Temperature compensating type) for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II) 22CMD09 |
| MLASJ021SB5222KWNA01 |
431Kb/3P |
Multilayer Ceramic Capacitors (High dielectric type) for Medical Devices classified as GHTF Classes A or B (Japan Classes I or II) 22S6C09 |