Manufacturer | Part # | Datasheet | Description |
NXP Semiconductors |
SOT108-1
|
10Kb / 1P |
SO14: plastic small outline package; 14 leads; body width 3.9 mm
2003 Mar 24 |
SOT340-1
|
11Kb / 1P |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
2003 Mar 24 |
Maxim Integrated Produc... |
21-0066
|
42Kb / 1P |
PACKAGE OUTLINE, TSSOP 4.40MM BODY
Rev L |
NXP Semiconductors |
SOT765-1
|
13Kb / 1P |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
2002 Jun 07 |
Fairchild Semiconductor |
SOIC24
|
209Kb / 1P |
24-Lead Small Outline IC (SOIC) 0.300 Body Width
|
Elantec Semiconductor |
MDP0040
|
149Kb / 1P |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Maxim Integrated Produc... |
21-0108
|
71Kb / 2P |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
Rev K |
Integrated Circuit Solu... |
ICS280
|
160Kb / 8P |
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body)
|
Integrated Circuit Syst... |
MK2761A
|
142Kb / 6P |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
Maxim Integrated Produc... |
21-0144B
|
135Kb / 2P |
PACKAGE OUTLINE
Rev B |