Product Description The TGA2925-SG HPA provides 11 •B of gain, 5.6 W of output power at 3.5 GHz and 2.5% EVM at 29 dBm output power. The device is ideally suited for high linearity, high power wireless data applications such as 802.16 and WiMax. The package has a high thermal conductivity copper alloy base. Internal partial matching simplifies system board layout by requiring a minimum of external components. Key Features • 3.5 GHz Application Frequency Range • 11 dB Nominal Gain • 2.5%EVM @29dBm OFDM signal at 3.5GHz • 37.5 dBm Nominal Psat • Internally Partially Matched • IMD3 -50 dBc @ 24 dBm SCL, Typical • Bias Conditions: 8 V @ 0.75 A (Quiescent) • 0.5 µm HFET Technology • 2 lead Cu-alloy base package Primary Applications • 802.16 and WiMax • S-Band Power Amplifiers
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