1 Features
Processor cores:
• Up to Four C7x floating point, vector DSP, up to
1.0 GHz, 320 GFLOPS, 1024 GOPS
• Up to Four Deep-learning matrix multiply
accelerator (MMA), up to 32 TOPS (8b) at 1.0 GHz
• TwoVision Processing Accelerators (VPAC) with
Image Signal Processor (ISP) and multiple vision
assist accelerators
• Depth and Motion Processing Accelerators
(DMPAC)
• Eight Arm® Cortex®-A72 microprocessor
subsystem at up to 2.0 GHz
– 2MB shared L2 cache per quad-core Cortex®-
A72 cluster
– 32KB L1 DCache and 48KB L1 ICache per
Cortex®-A72 core
• Eight Arm® Cortex®-R5F MCUs at up to 1.0 GHz
– 16K I-Cache, 16K D-Cache, 64K L2 TCM
– Two Arm® Cortex®-R5F MCUs in isolated MCU
subsystem
– Six Arm® Cortex®-R5F MCUs in general
compute partition
• GPU IMG BXS-64-4, 256kB Cache, up to 800
MHz, 50 GFLOPS, 4 GTexels/s
• Custom-designed interconnect fabric supporting
near max processing entitlement
Memory subsystem:
• Up to 8MB of on-chip L3 RAM with ECC and
coherency
– ECC error protection
– Shared coherent cache
– Supports internal DMA engine
• Up to Four External Memory Interface (EMIF)
module with ECC
– Supports LPDDR4 memory types
– Supports speeds up to 4266 MT/s
– Up to 4x32-b bus with inline ECC up to 68 GB/s
• General-Purpose Memory Controller (GPMC)
• 3x512KB on-chip SRAM in MAIN domain,
protected by ECC
Functional Safety:
• Functional Safety-Compliant targeted (on select
part numbers)
– Developed for functional safety applications
– Documentation available to aid ISO 26262
functional safety system design up to ASIL-D/
SIL-3 targeted
– Systematic capability up to ASIL-D/SIL-3
targeted
– Hardware integrity up to ASIL-D/SIL-3 targeted
for MCU Domain
– Hardware integrity up to ASIL-B/SIL-2 targeted
for Main Domain
– Hardware integrity up to ASIL-D/SIL-3 targeted
for Extended MCU (EMCU) portion of the Main
Domain
– Safety-related certification
• ISO 26262 planned
• AEC-Q100 qualilfied on part number variants
ending in Q1
Device security (on select part numbers):
• Secure boot with secure runtime support
• Customer programmable root key, up to RSA-4K
or ECC-512
• Embedded hardware security module
• Crypto hardware accelerators – PKA with ECC,
AES, SHA, RNG, DES and 3DES
High speed serial interfaces:
• Integrated ethernet switch supporting up to 8
(TDA4xH) or 4 (TDA4xP) external ports
– Two ports support 5Gb, 10Gb USXGMII or 5Gb
XFI
– All ports support 1Gb, 2.5Gb SGMII
– All ports can support QSGMII. A maximum of
2 (TDA4xH) or 1 (TDA4xP) QSGMII can be
enabled and uses all 8 or 4 internal lanes
• Up to 4x2-L/2x4L (TDA4xH) or 2x2L/1x4L
(TDA4xP) PCI-Express® (PCIe) Gen3 controllers
– Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3
(8.0GT/s) operation with auto-negotiation
• One USB 3.0 dual-role device (DRD) subsystem
– Enhanced SuperSpeed Gen1 Port
– Supports Type-C switching
– Independently configurable as USB host, USB
peripheral, or USB DRD
• Three CSI2.0 4L RX plus Two CSI2.0 4L TX
Ethernet
• Two RGMII/RMII interfaces
Automotive interfaces:
• Twenty Modular Controller Area Network (MCAN)
modules with full CAN-FD support
Display subsystem:
• Two DSI 4L TX (up to 2.5k)
• One eDP/DP interface with Multi-Display Support
(MST)
• One DPI
Audio interfaces:
• Five Multichannel Audio Serial Port (MCASP)
modules
Video acceleration:
• H.264/H.265 Encode/Decode, up to 960MP/s
(TDA4xH) or 480MP/s (TDA4xP)
Flash memory interfaces:
• Embedded MultiMediaCard Interface ( eMMC™
5.1)
• One Secure Digital® 3.0 / Secure Digital Input
Output 3.0 interfaces (SD3.0/SDIO3.0
• Universal Flash Storage (UFS 2.1) interface with
two lanes
• Two independent flash interfaces configured as
– One OSPI or HyperBus™ or QSPI flash
interfaces, and
– One QSPI flash interface
System-on-Chip (SoC) architecture:
• 16-nm FinFET technology
• 31 mm × 31 mm, 0.8-mm pitch, 1414-pin FCBGA
(ALY), enables IPC class 3 PCB routing
TPS6594-Q1 Companion Power Management
ICs (PMIC):
• Functional Safety support up to ASIL-D
• Flexible mapping to support different use cases

2 Applications
• Advanced surround view and park assistance systems
• Autonomous sensor fusion / perception systems including camera, radar and lidar sensors
• Mono and multi-sensor Front camera systems
• Next generation eMirror systems
• Industrial mobile robot (AGV/AMR) with safety functions
• Machine vision
• Smart retail
• Smart shopping cart
• Construction and agriculture
• Edge AI BOX
• Single Board Computer
• Off-highway vehicle control
• Industrial PC with AI
• ADAS Domain Controller

3 Description
The TDA4VH TDA4AH TDA4VP TDA4AP processor family is based on the evolutionary Jacinto™ 7 architecture,
targeted at ADAS and Autonomous Vehicle (AV) applications and built on extensive market knowledge
accumulated over a decade of TI’s leadership in the ADAS processor market. The unique combination highperformance
compute, deep-learning engine, dedicated accelerators for signal and image processing in an
functional safety compliant targeted architecture make the TDA4VH TDA4AH TDA4VP TDA4AP devices a great
fit for several imaging, vision, radar, sensor fusion and AI applications such as: Robotics, Mobile machineries,
Off-highway vehicle controller, Machine Vision, AI BOX, Gateways, Retail automation, Medical Imaging, and
so on. The TDA4VH TDA4AH TDA4VP TDA4AP provides high performance compute for both traditional and
deep learning algorithms at industry leading power/performance ratios with a high level of system integration to
enable scalability and lower costs for advanced automotive platforms supporting multiple sensor modalities in
centralized ECUs or stand-alone sensors. Key cores include next generation DSP with scalar and vector cores,
dedicated deep learning and traditional algorithm accelerators, latest Arm and GPU processors for general
compute, an integrated next generation imaging subsystem (ISP), video codec, Ethernet hub and isolated MCU
island. All protected by automotive grade safety and security hardware accelerators.
Key Performance Cores Overview
The “C7x” next generation DSP combines TI’s industry leading DSP and EVE cores into a single higher
performance core and adds floating point vector calculation capabilities, enabling backward compatibility for
legacy code while simplifying software programming. The new “MMA” deep learning accelerator enables
performance up to 8 TOPS within the lowest power envelope in the industry when operating at the typical
automotive worst case junction temperature of 125°C. The dedicated ADAS/AV hardware accelerators provide
vision pre-processing plus distance and motion processing with no impact on system performance.
General Compute Cores and Integration Overview
Separate eight core cluster configuration of Arm® Cortex®-A72 facilitates multi-OS applications with minimal
need for a software hypervisor. Eight Arm® Cortex®-R5F subsystems enable low-level, timing critical processing
tasks to leave the Arm® Cortex®-A72’s unencumbered for applications. The integrated IMG BXS-64-4 GPU
offers up to 50 GFLOPS to enable dynamic 3D rendering for enhanced viewing applications. Building on the
existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support
for higher bit depth, and features targeting analytics applications. Integrated diagnostics and safety features
support operations up to ASIL-D/SIL-3 levels while the integrated security features protect data against modern
day attacks. To enable systems requiring heavy data bandwidth, a PCIe hub and Gigabit Ethernet switch are
included along with CSI-2 ports to support throughput for many sensor inputs. To further the integration, the
TDA4VH TDA4AH TDA4VP TDA4AP family also includes an MCU island eliminating the need for an external
system microcontroller.