ADXL1005

Data Sheet

Rev. 0 | Page 4 of 14

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Acceleration

Mechanical Shock: Any Axis, Powered

or Unpowered per IEC 60068-2-27

10,000 g

Drop Test (Concrete Surface), per

AEC-Q100 Test G5

1.2 m

−0.3 V to +5.5 V

Output Short-Circuit Duration

(Any Pin to Common Ground)

Indefinite

Temperature Range (Storage)

−55°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

resistance measured in a one cubic foot sealed enclosure.

Table 3. Package Characteristics

Package Type

Device Weight

48°C/W

14.1°C/W

<0.2 g

test board with nine thermal vias. See JEDEC JESD51.

RECOMMENDED SOLDERING PROFILE

Figure 2 and Table 4 provide details about the recommended

soldering profile.

PREHEAT

CRITICAL ZONE

TIME

RAMP-DOWN

RAMP-UP

Figure 2. Recommended Soldering Profile

Table 4. Recommended Soldering Profile

Profile Feature

Condition

Sn63/Pb37

Pb-Free

3°C/sec

maximum

3°C/sec

maximum

Preheat

100°C

150°C

150°C

200°C

60 sec to

120 sec

60 sec to

180 sec

Ramp-Up Rate

3°C/sec

maximum

3°C/sec

maximum

Time Maintained Above

183°C

217°C

60 sec to

150 sec

60 sec to

150 sec

240 + 0/−5°C

260 + 0/−5°C

Time Within 5°C of Actual Peak

10 sec to

30 sec

20 sec to

40 sec

Ramp-Down Rate

6°C/sec

maximum

6°C/sec

maximum

Time 25°C to Peak Temperature

(t25°C)

6 min

maximum

8 min

maximum

ESD CAUTION