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BSC094N03S Datasheet(PDF) 2 Page - Infineon Technologies AG |
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BSC094N03S Datasheet(HTML) 2 Page - Infineon Technologies AG |
2 / 10 page ![]() BSC094N03S G Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, junction - case R thJC - - 2.4 K/W Thermal resistance, R thJA minimal footprint - - 62 junction - ambient 6 cm 2 cooling area2) -- 45 Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA 30 - - V Gate threshold voltage V GS(th) V DS=V GS, I D=25 µA 1.2 1.6 2 Zero gate voltage drain current I DSS V DS=30 V, V GS=0 V, T j=25 °C - 0.1 1 µA V DS=30 V, V GS=0 V, T j=125 °C - 10 100 Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 10 100 nA Drain-source on-state resistance R DS(on) V GS=4.5 V, I D=30 A - 11.2 14 m Ω V GS=10 V, I D=35 A - 7.8 9.4 Gate resistance R G -1 - Ω Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=35 A 26 53 - S 1)J-STD20 and JESD22 Values 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. 2) See figure 3 Rev. 1.01 page 2 2004-12-15 |
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