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RMASMU890ATF03 Datasheet(PDF) 12 Page - WALSIN TECHNOLOGY CORPORATION |
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RMASMU890ATF03 Datasheet(HTML) 12 Page - WALSIN TECHNOLOGY CORPORATION |
12 / 14 page Approval Sheet Page 12 of 14 ASC_RMASMU890ATF03_V02 Nov. 2017 Reliability test TEST PROCEDURE / TEST METHOD REQUIREMENT *Solderability *JIS C 0050-4.6 *JESD22-B102D *Solder bath temperature:255 5C *Immersion time:5 0.5 sec *Solder:Sn3Ag0.5Cu for lead-free *At least 95% of a surface of each terminal *electrode must be covered by fresh solder. *High temperature *JIS C 0021 *Temperature:90 C2C *Test duration:1000+24/-0 hours *Measurement to be made after keeping at *room temperature for 24 2 hrs *No mechanical damage. *Electrical specification shall satisfy the *descriptions in electrical characteristics under *the operational temperature range within -30 *~ 90°C. *Low temperature *JIS C 0020 *Temperature:-30 C2C *Test duration:1000+24/-0 hours *Measurement to be made after keeping at *room temperature for 24 2 hrs *No mechanical damage. *Electrical specification shall satisfy the *descriptions in electrical characteristics under *the operational temperature range within -30 *~ 90°C. *Temperature cycle *JIS C 0025 *1. 30 3 minutes at -303C, *2. 10~15 minutes at room temperature, *3. 30 3 minutes at +903C, *4. 10~15 minutes at room temperature, *Total 100 continuous cycles *Measurement to be made after keeping at *room temperature for 24 2 hrs *No mechanical damage. *Electrical specification shall satisfy the *descriptions in electrical characteristics under *the operational temperature range within -30 *~ 90°C. *High temperature operation *life (HTOL) *Temperature:90 C *VDD = 4.8V *Time:1000+24/-0 hrs. *Measurement to be made after keeping at *room temperature for 24 2 hrs *No mechanical damage. *Electrical specification shall satisfy the *descriptions in electrical characteristics under *the operational temperature range within -30 *~ 90°C. Soldering condition Typical examples of soldering processes that provide reliable joints without any damage are given in Figure 11. Figure 11. Infrared soldering profile 260 245 217 200 150 10 sec Time 30 sec min. 60~150 sec 480 sec max. to Peak 25 max. ramp up rate = 3°C/s max. ramp down rate = 6°C/s For SnAgCu series solder paste |
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