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TLV9022-Q1 Datasheet(PDF) 6 Page - Texas Instruments |
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TLV9022-Q1 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 32 page  6 TLV9022-Q1, TLV9032-Q1 SNOSDA9 – JUNE 2020 www.ti.com Product Folder Links: TLV9022-Q1 TLV9032-Q1 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information, TLV90x2-Q1 THERMAL METRIC (1) TLV9022-Q1, TLV9032-Q1 UNIT D (SOIC) PW (TSSOP) 8 pin 8 pin RqJA Junction-to-ambient thermal resistance 167.7 221.7 °C/W RqJC(top) Junction-to-case (top) thermal resistance 107.0 109.1 °C/W RqJB Junction-to-board thermal resistance 111.2 152.5 °C/W yJT Junction-to-top characterization parameter 53.1 36.4 °C/W yJB Junction-to-board characterization parameter 110.4 150.7 °C/W RqJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W |
Similar Part No. - TLV9022-Q1 |
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Similar Description - TLV9022-Q1 |
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