Data Sheet

HMC1163

Rev. 0 | Page 11 of 12

EVALUATION PRINTED CIRCUIT BOARD (PCB)

Figure 17. Evaluation PCB

The circuit board used in an application uses RF circuit design

techniques. Ensure that the signal lines have 50 Ω impedance

and that the package ground leads and backside ground paddle

are connected directly to the ground plane.

Use a sufficient number of via holes to connect the top and

bottom ground planes. The evaluation circuit board shown in

Figure 17 is available from Analog Devices, Inc., upon request.

BILL OF MATERIALS

Table 4. Bill of Materials for the EV1HMC1163LP5

Item

Description

J1 to J4

PCB mount SMA RF connectors

J5, J6

2 mm dc headers

C1 to C3

100 pF capacitors, 0402 package

C4

1000 pF capacitor, 0402 package

C5 to C7

2.2 μF tantalum capacitors

C8

0.01 μF capacitor, 0603 package

U1

HMC1163 VCO