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STM32469VG Datasheet(PDF) 201 Page - STMicroelectronics |
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STM32469VG Datasheet(HTML) 201 Page - STMicroelectronics |
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201 / 220 page  DS11189 Rev 7 201/220 STM32F469xx Package information 217 Figure 88. UFBGA169 - Recommended footprint Note: Non-solder mask defined (NSMD) pads are recommended. Note: 4 to 6 mils solder paste screen printing process. Device marking for UFBGA169 The following figure gives an example of topside marking orientation versus ball A1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to four decimal digits. Table 117. UFBGA169 - Recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 116. UFBGA169 - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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