STM32L151XE datasheet(107/136 Pages) STMICROELECTRONICS

Part #	STM32L151XE

Description	Ultra-low-power 32-bit MCU Arm®-based Cortex®-M3 with 512KB Flash, 80KB SRAM, 16KB EEPROM, LCD, USB, ADC, DAC

PDF	136 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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107 / 136 page

DS10002 Rev 10

107/136

STM32L151xE STM32L152xE

Electrical characteristics

114

Figure 29. Maximum dynamic current consumption on VREF+ supply pin during ADC

conversion

General PCB design guidelines

Power supply decoupling must be performed as shown in Figure 11. The applicable

procedure depends on whether VREF+ is connected to VDDA or not. The 100 nF capacitors

must be ceramic (good quality). They must be placed as close as possible to the chip.

ADC clock

Sampling (n cycles)

Conversion (12 cycles)

Iref+

300µA

700µA

MS36686V1

Table 57. Maximum source impedance RAIN max(1)

(µs)

RAIN max (kΩ)

Ts (cycles)

fADC=16 MHz(2)

Multiplexed channels

Direct channels

2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V

0.25

Not allowed

0.7

Not allowed

0.5625

0.8

Not allowed

2.0

1.0

2.0

0.8

4.0

3.0

1.5

3.0

1.8

6.0

4.5

6.8

4.0

15.0

10.0

15.0

10.0

30.0

20.0

32.0

25.0

50.0

40.0

192

50.0

384

1. Guaranteed by design.

2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be reduced

with respect to the minimum sampling time Ts (µs),

STM32L151XE Datasheet(PDF) 107 Page - STMicroelectronics

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