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STM32G081CB Datasheet(PDF) 113 Page - STMicroelectronics |
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STM32G081CB Datasheet(HTML) 113 Page - STMicroelectronics |
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113 / 136 page ![]() DS12231 Rev 4 113/136 STM32G081xB Package information 130 Figure 36. Recommended footprint for UFQFPN28 package 1. Dimensions are expressed in millimeters. Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 37. UFQFPN28 package marking example 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST's Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. MSv47913V2 Product identification (1) Date code Revision code G081GB R Y WW Pin 1 identifier |
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