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TDA4VE...ALZQ1 Datasheet(PDF) 248 Page - Texas Instruments |
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TDA4VE...ALZQ1 Datasheet(HTML) 248 Page - Texas Instruments |
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248 / 251 page  NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. PACKAGE OUTLINE 4226636/A 03/2021 www.ti.com FCBGA - 2.57 mm max height BALL GRID ARRAY ALZ0770A A 0.15 C 0.25 C A B 0.10 C B SYMM SYMM 23.1 22.9 23.1 22.9 ( 22.60) ( 18.60) ( 18.60) BALL A1 CORNER 0.2 C (0.67) 0.5 0.3 TYP 0.2 C (1.4) 2.57 2.37 C 21.6 TYP 21.6 TYP (0.7) TYP (0.7) TYP 0.8 TYP 0.8 TYP PIN 1 ID (OPTIONAL) 770 X Ø0.55 0.45 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH SEATING PLANE |
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