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STM32WB35CEU6A Datasheet(PDF) 175 Page - STMicroelectronics |
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STM32WB35CEU6A Datasheet(HTML) 175 Page - STMicroelectronics |
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175 / 196 page ![]() DS11929 Rev 14 175/196 STM32WB55xx STM32WB35xx Package information 185 Figure 42. WLCSP100 recommended footprint Device marking for WLCSP100 Figure 43 gives an example of topside marking orientation versus pin 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Table 103. WLCSP100 - Recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad (PCB Cu pad diameter) 0.250 mm Dsm 0.325 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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