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STM32G0C1NET6 Datasheet(PDF) 131 Page - STMicroelectronics |
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STM32G0C1NET6 Datasheet(HTML) 131 Page - STMicroelectronics |
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131 / 159 page ![]() DS13564 Rev 4 131/159 STM32G0C1xC/xE Package information 154 6.3 UFQFPN48 package information UFQFPN48 is a 48-lead, 7x7 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package Figure 43. UFQFPN48 package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. Table 82. UFQFPN48 package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.500 0.550 0.600 0.0197 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 D 6.900 7.000 7.100 0.2717 0.2756 0.2795 E 6.900 7.000 7.100 0.2717 0.2756 0.2795 D2 5.500 5.600 5.700 0.2165 0.2205 0.2244 E2 5.500 5.600 5.700 0.2165 0.2205 0.2244 A0B9_ME_V3 D Pin 1 identifier laser marking area EE D Y D2 E2 Exposed pad area Z 1 48 Detail Z R 0.125 typ. 1 48 L C 0.500x45° pin1 corner A Seating plane A1 b e ddd Detail Y T |
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