Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

TLV1117CKTER

NRND

PFM

KTE

3

2000

TBD

CU SNPB

Level-1-220C-UNLIM

TLV1117CKTPR

NRND

PFM

KTP

2

3000

TBD

CU SNPB

Level-1-220C-UNLIM

TLV1117CKTPRG3

NRND

PFM

KTP

2

3000 Green (RoHS &

no Sb/Br)

CU SN

Level-1-260C-UNLIM

TLV1117CKTTR

ACTIVE

DDPAK/

TO-263

KTT

3

1000 Green (RoHS &

no Sb/Br)

CU SN

Level-3-245C-168 HR

TLV1117CKTTRG3

ACTIVE

DDPAK/

TO-263

KTT

3

1000 Green (RoHS &

no Sb/Br)

CU SN

Level-3-245C-168 HR

TLV1117CKVURG3

ACTIVE

PFM

KVU

3

2500 Green (RoHS &

no Sb/Br)

CU SN

Level-3-260C-168 HR

TLV1117IDCY

ACTIVE

SOT-223

DCY

4

80

TBD

CU SNPB

Level-2-235C-1 YEAR

TLV1117IDCYG3

ACTIVE

SOT-223

DCY

4

80

Green (RoHS &

no Sb/Br)

CU SN

Level-2-260C-1YEAR

TLV1117IDCYR

ACTIVE

SOT-223

DCY

4

2500

TBD

CU SNPB

Level-2-235C-1 YEAR

TLV1117IDRJR

ACTIVE

SON

DRJ

8

1000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1YEAR

TLV1117IDRJRG4

ACTIVE

SON

DRJ

8

1000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1YEAR

TLV1117IKCS

ACTIVE

TO-220

KCS

3

50

TBD

CU SN

N / A for Pkg Type

TLV1117IKCSE3

ACTIVE

TO-220

KCS

3

50

Pb-Free

(RoHS)

CU SN

N / A for Pkg Type

TLV1117IKTER

NRND

PFM

KTE

3

2000

TBD

CU SNPB

Level-1-220C-UNLIM

TLV1117IKTPR

NRND

PFM

KTP

2

3000

TBD

CU SNPB

Level-1-220C-UNLIM

TLV1117IKTPRG3

NRND

PFM

KTP

2

3000 Green (RoHS &

no Sb/Br)

CU SN

Level-1-260C-UNLIM

TLV1117IKTTR

ACTIVE

DDPAK/

TO-263

KTT

3

1000 Green (RoHS &

no Sb/Br)

CU SN

Level-3-245C-168 HR

TLV1117IKTTRG3

ACTIVE

DDPAK/

TO-263

KTT

3

1000 Green (RoHS &

no Sb/Br)

CU SN

Level-3-245C-168 HR

TLV1117IKVURG3

ACTIVE

PFM

KVU

3

2500 Green (RoHS &

no Sb/Br)

CU SN

Level-3-260C-168 HR

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

PACKAGE OPTION ADDENDUM

www.ti.com

29-Sep-2006

Addendum-Page 4