ST72361 datasheet(180/224 Pages) STMICROELECTRONICS

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ST72361

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12.2 ABSOLUTE MAXIMUM RATINGS

Stresses above those listed as “absolute maxi-

mum ratings” may cause permanent damage to

the device. This is a stress rating only and func-

tional operation of the device under these condi-

tions is not implied. Exposure to maximum rating

conditions for extended periods may affect device

reliability.

12.2.1 Voltage Characteristics

12.2.2 Current Characteristics

12.2.3 Thermal Characteristics

Notes:

1. Directly connecting the RESET and I/O pins to VDD or VSS could damage the device if an unintentional internal reset

is generated or an unexpected change of the I/O configuration occurs (for example, due to a corrupted program counter).

To guarantee safe operation, this connection has to be done through a pull-up or pull-down resistor (typical: 4.7k

Ω for

RESET, 10k

Ω for I/Os). Unused I/O pins must be tied in the same way to VDD or VSS according to their reset configuration.

2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be

respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN>VDD

while a negative injection is induced by VIN < VSS. For true open-drain pads, there is no positive injection current, and the

corresponding VIN maximum must always be respected

3. All power (VDD) and ground (VSS) lines must always be connected to the external supply.

4. Negative injection disturbs the analog performance of the device.

See note in “10-BIT ADC CHARACTERISTICS” on

page 204

5. When several inputs are submitted to a current injection, the maximum

ΣIINJ(PIN) is the absolute sum of the positive

and negative injected currents (instantaneous values). These results are based on characterization with

ΣIINJ(PIN) maxi-

mum current injection on four I/O port pins of the device.

Symbol

Ratings

Maximum value

Unit

VDD - VSS

Supply voltage

6.5

VPP - VSS

Programming Voltage

VIN

Input voltage on any pin1)2)

VSS - 0.3 to VDD + 0.3

∆VDDx| and |∆VSSx|

Variations between different digital power pins

|VSSA - VSSx|

Variations between digital and analog ground pins

VESD(HBM)

Electro-static discharge voltage (Human Body Model)

see Section 12.8.3 on page 192

VESD(MM)

Electro-static discharge voltage (Machine Model)

Symbol

Ratings

Maximum value

Unit

IVDD

Total current into VDD power lines (source)

150

IVSS

Total current out of VSS ground lines (sink)

IIO

Output current sunk by any standard I/O and control pin

Output current sunk by any high sink I/O pin

Output current source by any I/Os and control pin

- 25

IINJ(PIN)

2)4)

Injected current on VPP pin

± 5

Injected current on RESET pin

Injected current on OSC1 and OSC2 pins

Injected current on PB3 (on Flash devices)

Injected current on any other pin5)

± 5

ΣIINJ(PIN)2)

Total injected current (sum of all I/O and control pins)5)

± 25

Symbol

Ratings

Value

Unit

TSTG

Storage temperature range

-65 to +150

°C

Maximum junction temperature (see Section 13.2 "THERMAL CHARACTERISTICS")

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