4.8 Mechanical - 32-QFN Package

Symbol Minimum Nominal Maximum

A

0.70

-

0.95

A1

0.00

0.02

0.05

b0.18

0.25

0.32

C

-

0.20 REF

-

D4.90

5.00

5.10

D2

3.05

-

3.65

E4.90

5.00

5.10

E2

3.05

-

3.65

e-

0.50

-

L0.30

0.40

0.50

y0.00

-

0.075

Dimensions In Millimeters

Note that there is no functional requirement for the large pad on the underside of this package to be

soldered. If the final application requires this area to be soldered for mechanical reasons, the pad to

which it is soldered must be isolated and contained under the footprint only.

4.9 Mechanical - 48-SSOP Package

H

A

C

B

D

E

F

a

J

G

All dimensions in millimeters

0.89

0.30

16.18

0.25

2.51

0.30

7.59

10.67

Max

0.64

0.10

15.57

0.10

0.635

Typ

2.16

0.20

7.39

10.03

Min

a

J

H

G

F

E

D

C

B

A

13

QT1080 R11.06/0806