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MAC7131CVF50 Datasheet(PDF) 9 Page - Freescale Semiconductor, Inc |
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MAC7131CVF50 Datasheet(HTML) 9 Page - Freescale Semiconductor, Inc |
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9 / 56 page  ElectricalCharacteristics MAC7100 Microcontroller Family Hardware Specifications, Rev. 1.2 Preliminary Freescale Semiconductor 9 Note that the JEDEC specification reserves the symbol RθJA or θJA (Theta-JA) strictly for junction-to- ambient thermal resistance on a 1s test board in natural convection environment. RθJMA or θJMA (Theta-JMA) will be used for both junction-to-ambient on a 2s2p test board in natural convection and for junction-to-ambient with forced convection on both 1s and 2s2p test boards. It is anticipated that the generic name, θ JA, will continue to be commonly used. The average chip-junction temperature (TJ) in °C is obtained from the formula: Eqn. 1 where The total power dissipation is calculated as: Eqn. 2 where Two cases must be considered for PINT: 1. Internal voltage regulator enabled: Eqn. 3 2. Internal voltage regulator disabled (VDDR = VSSR = system ground): Eqn. 4 PIO is the sum of all output currents on input/output pins associated with VDDX: Eqn. 5 where Eqn. 6 or Eqn. 7 Table 10. Thermal Resistance 1/8 Simulation Model Packaging Parameters Component Conductivity Mold Compound 0.9 W/m K Leadframe (Copper) 263 W/m K Die Attach 1.7 W/m K T J T A P D Θ JA ⋅ + = T J Junction Temperature ( °C) = T A Ambient Temperature ( °C) = P D Total Chip Power Dissipation (W) = Θ JA Package Thermal Resistance ( °C/W) = P D P INT P IO + = P INT Chip Internal Power Dissipation (W) = P IO Input / Output Power Dissipation (W) = P INT I DDRVDDR × () I DDAVDDA × () + = P INT I DD2.5 V DD2.5 × () I DDPLL V DDPLL × () I DDAVDDA × () ++ = P IO R DSON i ∑ I IO i ()2 ⋅ = R DSON V OL I OL --------- (for outputs driven low) = R DSON V DDXVOH – I OL ------------------------------- (for outputs driven high) = |
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