PIC16F690-ISLASHSSSQTP datasheet(238/294 Pages) MICROCHIP

238 / 294 page

PIC16F631/677/685/687/689/690

DS41262D-page 236

17.5

Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +125°C

Param

No.

Sym

Characteristic

Typ

Units

Conditions

TH01

θJA

Thermal Resistance

Junction to Ambient

62.4

C/W

20-pin PDIP package

85.2

C/W

20-pin SOIC package

108.1

C/W

20-pin SSOP package

C/W

20-pin QFN 4x4mm package

TH02

θJC

Thermal Resistance

Junction to Case

28.1

C/W

20-pin PDIP package

24.2

C/W

20-pin SOIC package

32.2

C/W

20-pin SSOP package

2.5

C/W

20-pin QFN 4x4mm package

TH03

TDIE

Die Temperature

150

For derated power calculations

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL

Internal Power Dissipation

—

PINTERNAL = IDD x VDD

(NOTE 1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))

TH07

PDER

Derated Power

—

PDER = PDMAX (TDIE - TA)/

θJA

(NOTE 2, 3)

Note 1:

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient Temperature.

Maximum allowable power dissipation is the lower value of either the absolute maximum total power

dissipation or derated power.

PIC16F690-I/SSSQTP Datasheet(PDF) 238 Page - Microchip Technology

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