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STM32G474CB Datasheet(PDF) 154 Page - STMicroelectronics |
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STM32G474CB Datasheet(HTML) 154 Page - STMicroelectronics |
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154 / 232 page  Electrical characteristics STM32G474xB STM32G474xC STM32G474xE 154/232 DS12288 Rev 1 Figure 27. ADC accuracy characteristics Figure 28. Typical connection diagram using the ADC 1. Refer to Table 69: ADC characteristics for the values of RAIN and CADC. 2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (refer to Table 57: I/O static characteristics for the value of the pad capacitance). A high Cparasitic value downgrades conversion accuracy. To remedy this, fADC should be reduced. 3. Refer to Table 57: I/O static characteristics for the values of Ilkg. General PCB design guidelines Power supply decoupling must be performed as shown in Figure 15: Power supply scheme. The decoupling capacitor on VDDA must be ceramic (good quality) and it must be placed as close as possible to the chip. |
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