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L9679P Datasheet(PDF) 275 Page - STMicroelectronics |
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L9679P Datasheet(HTML) 275 Page - STMicroelectronics |
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275 / 279 page ![]() DS11627 Rev 7 275/279 L9679P Package information 278 Table 75. TQFP100 (14x14x1.4 mm exp. pad down) package mechanical data Ref Dimensions Millimeters Inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min. Typ. Max. Min. Typ. Max. A - - 1.20 - - 0.0472 A1 0.05 - 0.15 0.0020 - 0.0059 A2 0.95 1.00 1.05 0.0374 0.0394 0.0413 b 0.17 0.22 0.27 0.0067 0.0087 0.0106 c 0.09 - 0.20 0.0035 - 0.0079 D 15.80 16.00 16.20 0.6220 0.6299 0.6378 D1 13.80 14.00 14.20 0.5433 0.5512 0.5591 D2(2) 2. The size of exposed pad is variable depending on lead frame design pad size. End user should verify “D2” and “E2” dimensions for each device application. 5.40 - 8.50 0.2126 - 0.3346 D3 - 12.00 - - 0.4724 - E 15.80 16.00 16.20 0.622 0.6299 0.6378 E1 13.80 14.00 14.20 0.5433 0.5512 0.5591 E2(2)) 5.40 - 8.50 0.2126 - 0.3346 E3 - 12.00 - - 0.4724 - e - 0.50 - - 0.0197 - L 0.45 0.60 0.75 0.0177 0.0236 0.0295 L1 - 1.00 - - 0.0394 - k - 3.50 7.00 - 0.1378 0.2756 ccc - - 0.08 - - 0.0031 |
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