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STM32F427AI Datasheet(PDF) 221 Page - STMicroelectronics |
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STM32F427AI Datasheet(HTML) 221 Page - STMicroelectronics |
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221 / 240 page ![]() DS9405 Rev 12 221/240 STM32F427xx STM32F429xx Package information 231 7.9 TFBGA216 package information (A0L2) This TFBGA is a 216-ball, 13 x 13 mm, 0.8 mm pitch, fine pitch ball grid array package. Figure 93. TFBGA216 - Outline 1. Drawing is not to scale. 2. • The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metalized markings, or other feature of package body or integral heat slug. • A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional A0L2_ME_V3 Seating plane A1 e F G D R Øb (216 balls) A E TOP VIEW BOTTOM VIEW 1 15 e A A2 Y X Z ddd Z D1 E1 eee Z Y X fff Ø Ø M M Z A1 ball identifier A1 ball index area |
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