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BAT3007KFILM Datasheet(PDF) 10 Page - STMicroelectronics |
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BAT3007KFILM Datasheet(HTML) 10 Page - STMicroelectronics |
10 / 12 page ![]() Package information BAT30 Series 10/12 Figure 17. SOT-666 footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 9. SOT-666 dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 0.27 0.34 0.007 0.011 0.013 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 e 0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 0.004 0.012 L3 0.10 0.004 D b L3 L1 e b1 E1 L2 E A A3 0.50 2.60 0.62 0.30 0.99 |
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