TERMINAL FUNCTIONS

NC

VSS

FAULT

IN

OUT

CE

1

2

3

6

8

7

4

5

VBAT

ILIM

bq24313

bq24315

bq24313

bq24315

TERMINAL

I/O

DESCRIPTION

NAME

DSG

Input power. Connect IN to the external DC supply. Bypass IN to VSS with a 1

µF ceramic capacitor

IN

1

I

(minimum).

VSS

2

–

Ground terminal

This pin may have internal circuits used for test purposes. Do not make any external connection to this

NC

3

pin for normal operation.

Open-drain, device status output. FAULT = Low indicates that the input FET Q1 is off due to input

FAULT

4

O

overvoltage, input overcurrent, battery overvoltage, or thermal shutdown. FAULT is high impedance

during normal operation. Connect a pullup resistor from FAULT to the desired logic level voltage rail.

5

I

Chip enable active low input. Connect CE = High to disable the IC and turn the input FET off. Connect

CE

CE = low for normal operation. CE is internally pulled down.

VBAT

6

I

Battery voltage sense input. Connect to the battery pack positive terminal through a resistor.

Input overcurrent threshold programming. Connect a resistor from ILIM to VSS to set the overcurrent

ILIM

7

I/O

threshold.

8

O

Output terminal to the charging system. Connect OUT to the external load circuitry. Bypass OUT to VSS

OUT

with a 1

µF ceramic capacitor (minimum).

There is an internal electrical connection between the exposed thermal pad and the VSS pin of the

device. The thermal pad must be connected to the same potential as the VSS pin on the printed circuit

Thermal PAD

–

board. Do not use the thermal pad as the primary ground input for the device. The VSS pin must be

connected to ground at all times.

DSG Package

(Top View)

6

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