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BQ24313DSGR Datasheet(PDF) 15 Page - Texas Instruments

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Part # BQ24313DSGR
Description  OVERVOLTAGE AND OVERCURRENT PROTECTION IC AND Li CHARGER FRONT-END PROTECTION IC
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

BQ24313DSGR Datasheet(HTML) 15 Page - Texas Instruments

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IN
OUT
Charger
Accessory
powersupply
EN
DIS
Battery
pack
torestof
system
e.g.
cellphone
AC Adapter
bq24313
bq24315
IN
OUT
Charger
Accessory
powersupply
EN
DIS
Battery
pack
torestof
system
e.g.
cellphone
bq24313
bq24315
PCB Layout Guidelines:
bq24313
bq24315
www.ti.com............................................................................................................................................... SLUS817A – MARCH 2008 – REVISED NOVEMBER 2008
Figure 24. Charging - The Red Arrows Show the Direction of Current Flow
Figure 25. Powering an Accessory - The Red Arrows Show the Direction of Current Flow
In the second case, when power is being delivered to an accessory, the bq24313/bq24315 device is required to
support current flow from the OUT pin to the IN pin.
If VOUT > UVLO + 0.7V, FET Q1 is turned on, and the reverse current does not flow through the diode but
through Q1. Q1 remains ON as long as VOUT > UVLO – Vhys(UVLO) + RDS(on) × I(ACCESSORY). Within this voltage
range, the reverse current capability is the same as the forward capability, 1.5A. It should be noted that there is
no overcurrent protection in this direction.
• This device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages.
Potentially, high voltages may be applied to this IC. It has to be ensured that the edge-to-edge clearances of
PCB traces satisfy the design rules for high voltages.
• The device uses SON packages with a PowerPAD™. For good thermal performance, the PowerPAD should
be thermally coupled with the PCB ground plane. In most applications, this will require a copper pad directly
under the IC. This copper pad should be connected to the ground plane with an array of thermal vias.
• C
IN and COUT should be located close to the IC. Other components like R(ILIM) and RBAT should also be
located close to the IC.
Copyright © 2008, Texas Instruments Incorporated
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Product Folder Link(s): bq24313 bq24315


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