PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Supply Current Section

Termpwr Supply Current

All termination lines = Open

20

29

mA

All termination lines = 0.5V

400

435

mA

Power Down Mode

DISCNCT = Open

100

150

µA

Output Section (Termination Lines)

Termination Impedance

TJ = 25

°C

102

110

118

Ω

97

129

Ω

Output High Voltage

°C

2.6

2.9

3.1

V

2.55

3.2

V

Max Output Current

°C

-19.5

-21.4

-22.4

mA

-18.5

-22.4

mA

Max Output Current

°C

-18.0

-21.5

-22.4

mA

-17.0

-22.4

mA

Output Leakage

DISCNCT = 4V

TRMPWR = 0V to 5.25V

REG = 0V

10

400

nA

100

µA

TRMPWR = 0V to 5.25V, REG = Open

10

400

nA

Output Capacitance

DISCNCT = Open (Note 2)

10

13

pF

Regulator Section

Regulator Output Voltage

°C

2.7

2.9

3.1

V

2.55

3.2

V

Line Regulation

TRMPWR = 4V to 6V

10

20

mV

Load Regulation

20

50

mV

Drop Out Voltage

All Termination Lines = 0.5V

1.0

1.2

V

Short Circuit Current

-450

-650

-850

mA

Sinking Current Capability

20

40

mA

Thermal Shutdown

170

°C

Disconnect Section

Disconnect Threshold

1.1

1.4

1.7

V

Threshold Hysteresis

100

mV

Input Current

DISCNCT = 0V

150

200

µA

UC5602

Note 1: Measuring each termination line while other 17 are low (0.5V).

Note 2: Guaranteed by design. Not 100% tested in production.

DWP package: (see packaging section of UICC data book for more details on thermal performance)

Thermal Resistance Junction to Leads,

θjL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18°C/W

Thermal Resistance Junction to Ambient,

θja . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33°-43°C/W

N package:

Thermal Resistance Junction to Leads,

θjL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50°C/W

Thermal Resistance Junction to Ambient,

θja . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°-105°C/W

QP package:

Thermal Resistance Junction to Leads,

θjL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15°C/W

Thermal Resistance Junction to Ambient,

θja . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30°-40°C/W

THERMAL DATA

Note: The above numbers for

θjL are maximums for the limiting thermal resistance of the package in a standard mounting configu-

ration. The

θja numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of the above

numbers assume no ambient airflow.

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