PIC16F616-ISLASHML datasheet(155/214 Pages) MICROCHIP

155 / 214 page

DS41288F-page 155

PIC16F610/616/16HV610/616

15.10 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +125°C

Param

No.

Sym

Characteristic

Typ

Units

Conditions

TH01

θJA

Thermal Resistance

Junction to Ambient

70*

C/W

14-pin PDIP package

85.0*

C/W

14-pin SOIC package

100*

C/W

14-pin TSSOP package

37*

C/W

16-pin QFN 4x4mm package

TH02

θJC

Thermal Resistance

Junction to Case

32.5*

C/W

14-pin PDIP package

31.0*

C/W

14-pin SOIC package

31.7*

C/W

14-pin TSSOP package

2.6*

C/W

16-pin QFN 4x4mm package

TH03

TDIE

Die Temperature

150*

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL

Internal Power Dissipation

—

PINTERNAL = IDD x VDD

(NOTE 1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))

TH07

PDER

Derated Power

—

PDER = PDMAX (TDIE - TA)/

θJA

(NOTE 2)

These parameters are characterized but not tested.

Note 1:

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient Temperature.

PIC16F616-I/ML Datasheet(PDF) 155 Page - Microchip Technology

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