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PIC16F616-H/ML Datasheet(PDF) 168 Page - Microchip Technology |
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PIC16F616-H/ML Datasheet(HTML) 168 Page - Microchip Technology |
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168 / 214 page ![]() PIC16F610/616/16HV610/616 DS41288F-page 168 © 2009 Microchip Technology Inc. 15.13 High Temperature Operation This section outlines the specifications for the PIC16F616 device operating in a temperature range between -40°C and 150°C.(4) The specifications between -40°C and 150°C(4) are identical to those shown in DS41302 and DS80329. TABLE 15-13: ABSOLUTE MAXIMUM RATINGS Note 1: Writes are not allowed for Flash Program Memory above 125°C. 2: All AC timing specifications are increased by 30%. This derating factor will include parameters such as TPWRT. 3: The temperature range indicator in the part number is “H” for -40°C to 150°C.(4) Example: PIC16F616T-H/ST indicates the device is shipped in a tAPE and reel config- uration, in the TSSOP package, and is rated for operation from -40°C to 150°C.(4) 4: AEC-Q100 reliability testing for devices intended to operate at 150°C is 1,000 hours. Any design in which the total oper- ating time from 125°C to 150°C will be greater than 1,000 hours is not warranted without prior written approval from Microchip Technology Inc. Parameter Source/Sink Value Units Max. Current: VDD Source 20 mA Max. Current: VSS Sink 50 mA Max. Current: PIN Source 5 mA Max. Current: PIN Sink 10 mA Pin Current: at VOH Source 3 mA Pin Current: at VOL Sink 8.5 mA Port Current: A and C Source 20 mA Port Current: A and C Sink 50 mA Maximum Junction Temperature 155 °C Note: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. |
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