Document #: 38-05486 Rev. *H

Page 5 of 16

Capacitance

For all packages. Tested initially and after any design or process changes that may affect these parameters.

Parameter

Description

Test Conditions

Max

Unit

Input capacitance

10

pF

Output capacitance

10

pF

Thermal Resistance

Tested initially and after any design or process changes that may affect these parameters.

Parameter

Description

Test Conditions

VFBGA

Package

TSOP II

Package

Unit



JA

Thermal resistance

(Junction to ambient)

Still Air, soldered on a 4.25 × 1.125 inch,

two-layer printed circuit board

58.85

28.2

°C/W



JC

Thermal resistance

(Junction to case)

17.01

3.4

°C/W

Figure 3. AC Test Loads and Waveforms

Parameters

2.2 V - 2.7 V

2.7 V - 3.6 V

Unit

R1

16600

1103



R2

15400

1554



8000

645



1.2

1.75

V

OUTPUT

R2

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

Rise Time = 1 V/ns

Fall Time = 1 V/ns

OUTPUT

Equivalent to: THÉVENIN EQUIVALENT

ALL INPUT PULSES

R1