MPC5673K datasheet(138/140 Pages) FREESCALE

138 / 140 page

MPC5675K Microcontroller Data Sheet, Rev. 4

Preliminary—Subject to Change Without Notice

Document revision history

Freescale Semiconductor

138

7. MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering

Documents at 800-854-7179 or 303-397-7956.

8. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an

Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.

9. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled

Applications,” Electronic Packaging and Production, pp. 53–58, March 1998.

10. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance

and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp.

212–220.

Document revision history

Table 77 summarizes revisions to this document.

Table 77. Revision history

Revision

Date

Description of Changes

6 Oct 2009

Initial release.

6 Dec 2009

Updated ball map tables, pin mux tables, supply and system pin tables.

Added PMC specifications.

2 Jul 2010

Updated ball map tables, pin mux tables, supply and system pin tables.

Updated pad specifications.

Added reset specifications section.

430 Apr 2011

Removed thickness dimension from package diagrams on cover page.

Added footnote “Do not connect pin directly to a power supply or ground” for MDO[0:15]

and MSEO[0:1] pins to Table 9 and Table 10.

In Table 17, PMC electrical specifications:

– Added mininum and maximum slew rate specifications for LvdReg.

– Removed LvdC minimum and maximum hysteresis specifications

– Removed HvdC minimum and maximum hysteresis specifications

– Corrected HvcD nominal hysreresis from 1.32 to 1.36

In Table 18, updated specifications for device Q (FET).

Renamed Table 19 to “Current consumption characteristics.”

In Table 19, updated ADC current consumption to 1.2 mA per ADC plus 0.7 mA (2.0 mA

total) for ADC0.

– Removed “Typical” figures for these specifications.

– Added footnote “ADC0 includes 0.7 mA dissipation for the temperature sensor

(TSENS).”

Updated Accuracy specification in Table 20,Temperature sensor electrical characteristics:

changed “TJ = –40 °C to TA = 25 °C” to “TJ = –40 °C to TA = 125 °C,” removed row “TJ

= TA to 125 °C”.

In Table 21,Main oscillator electrical characteristics, added symbol name FXOSCHS for

Oscillator frequency specification.

Renamed Section 3.9, “Power dissipation and current consumption,” to Section 3.9,

Supply current characteristics.

in Table 23, RC oscillator electrical characteristics:

– Added specification



IRCTRIM “Internal RC oscillator trimming step.”

– Removed specification



RCTRIM “Post trim accuracy: The variation of the PTF from

the 16 MHz” (specification replaced by



IRCTRIM “Internal RC oscillator trimming step”).

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