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AK4160 Datasheet(PDF) 38 Page - Asahi Kasei Microsystems |
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AK4160 Datasheet(HTML) 38 Page - Asahi Kasei Microsystems |
38 / 40 page ![]() [AK4160] MS1313-E-01 2011/11 - 38 - PACKAGE 4.00±0.05 A B 0.18±0.05 22 1 7 8 14 15 21 28 C 0.40 Ref 2.30±0.10 0.08 C 0.05MAX 0.75±0.05 C0.3 M 0.07 C A B 28pin QFN (Unit: mm) Top View Bottom View Note: The thermal die pad must be open or connected to the ground. ■ Package & Lead frame material Package molding compound: Epoxy Resin, Halogen (Br, Cl) Free Lead frame material: Cu Alloy Lead frame surface treatment: Solder Plate |
Similar Part No. - AK4160 |
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Similar Description - AK4160 |
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