93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C

DS21797D-page 18

 2004 Microchip Technology Inc.

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

10

5

0

10

5

0

β

Mold Draft Angle Bottom

10

5

0

10

5

0

α

Mold Draft Angle Top

0.30

0.25

0.19

.012

.010

.007

B

Lead Width

0.20

0.15

0.09

.008

.006

.004

c

Lead Thickness

0.70

0.60

0.50

.028

.024

.020

L

Foot Length

3.10

3.00

2.90

.122

.118

.114

D

Molded Package Length

4.50

4.40

4.30

.177

.173

.169

E1

Molded Package Width

6.50

6.38

6.25

.256

.251

.246

E

Overall Width

0.15

0.10

0.05

.006

.004

.002

A1

Standoff

§

0.95

0.90

0.85

.037

.035

.033

A2

Molded Package Thickness

1.10

.043

A

Overall Height

0.65

.026

p

Pitch

8

8

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

α

A2

A

A1

L

c

β

φ

1

2

D

n

p

B

E

E1

Foot Angle

φ

04

80

48

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005” (0.127mm) per side.

JEDEC Equivalent: MO-153

Drawing No. C04-086

§ Significant Characteristic