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NANOASMDC035F-2 Datasheet(PDF) 16 Page - Tyco Electronics |
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NANOASMDC035F-2 Datasheet(HTML) 16 Page - Tyco Electronics |
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16 / 26 page  188 RoHS Compliant, ELV Compliant 12 Lead material AGRF400 to AGRF1100 : Tin Plated Copper, 0.52mm2 (20AWG) ø 0.8 mm/0.032in AGRF1200 to AGRF1400 : Tin Plated Copper, 0.82mm2 (18AWG) ø 1.0mm/0.040in Soldering characteristics Solderability per ANSI/J-STD-002 Category 3 Solder heat withstand AGRF400: per IEC68-2-20 Test Tb, Method 1A, Condition A: can withstand 5 seconds at 260°C ± 5°C AGRF500-AGRF1400: per IEC68-2-20 Test Tb, Method 1A, Condition B: can withstand 10 seconds at 260°C ± 5°C Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0 Operation temperature -40°C~85°C Note: See PS400 for other physical characteristics. Devices are not designed to be placed through a reflow process. Test Conditions Resistance Change Passive aging 70°C, 1000 hours ±5% 85°C, 1000 hours ±5% Humidity aging 85°C, 85% RH, 1000 hours ±5% Thermal shock 85°C, -40°C (10 times) ±5% Solvent resistance MIL-STD-202, Method 215F No change Note: See PS400 for other environmental specifications. AGRF Physical Characteristics Environmental Specifications Lead material AHRF050 to AHRF200 : Tin-plated Copper Clad Steel, 0.205mm2 (24 AWG), ø 0.51mm/0.020in AHRF300 to AHRF1100 : Tin-plated copper 0.52mm2 (20 AWG), ø 0.81mm/0.032 in AHRF1300 to AHRF1500 : Tin-plated copper 0.82mm2 (18 AWG), ø 1.0mm/0.04 in Soldering characteristics Solderability per ANSI/J-STD 002 Category 3 Solder heat withstand per IEC 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ± 5°C Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0 requirements Operation temperature -40°C~125°C Note: See PS400 for other physical characteristics. Devices are not designed to be placed through a reflow process. Test Conditions Resistance Change Passive aging 70°C, 1000 hours ±5% 85°C, 1000 hours ±5% Humidity aging 85°C, 85% RH, 1000 hours ±5% Thermal shock 125°C, -40°C (10 times) ±5% Solvent resistance MIL-STD-202, Method 215F No change Note: See PS400 for other environmental specifications. AHRF Physical Characteristics Environmental Specifications Table A5 Physical Characteristics and Environmental Specifications for Automotive Devices Lead material AHEF050 to AHEF100 : Tin-plated Copper Clad Steel, 0.205mm2 (24 AWG), ø 0.51mm/0.020in. AHEF300 to AHEF750 : Tin-plated Copper 0.52mm2 (20 AWG), ø 0.81mm/0.032in AHEF1000 : Tin-plated copper 0.82mm2 (18 AWG), ø 1.0mm/0.04 in Soldering characteristics Solderability per ANSI/J-STD 002 Category 3 Solder heat withstand per IEC 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ± 5°C Insulating material Cured, flame-retardant epoxy polymer; meets UL 94V-0 requirements Operation temperature -40°C~125°C Note: See PS400 for other physical characteristics. Devices are not designed to be placed through a reflow process. AHEF Physical Characteristics |
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