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STM8L151M8 Datasheet(PDF) 129 Page - STMicroelectronics |
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STM8L151M8 Datasheet(HTML) 129 Page - STMicroelectronics |
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129 / 134 page  DocID17943 Rev 6 129/134 STM8L15xx8, STM8L15xR6 Package characteristics 133 Figure 53. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. Table 66. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.500 0.550 0.600 0.0197 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 D 6.900 7.000 7.100 0.2717 0.2756 0.2795 E 6.900 7.000 7.100 0.2717 0.2756 0.2795 D2 5.500 5.600 5.700 0.2165 0.2205 0.2244 E2 5.500 5.600 5.700 0.2165 0.2205 0.2244 L 0.300 0.400 0.500 0.0118 0.0157 0.0197 T - 0.152 - - 0.0060 - b 0.200 0.250 0.300 0.0079 0.0098 0.0118 e - 0.500 - - 0.0197 - ddd 0.080 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. |
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