STM32F207IC datasheet(169/178 Pages) STMICROELECTRONICS

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DocID15818 Rev 11

169/178

STM32F20xxx

Revision history

177

22-Apr-2011

(continued)

Updated Typical and maximum current consumption conditions, as

well as Table 21: Typical and maximum current consumption in Run

mode, code with data processing running from Flash memory (ART

accelerator disabled) and Table 20: Typical and maximum current

consumption in Run mode, code with data processing running from

Flash memory (ART accelerator enabled) or RAM. Added Figure 23,

Figure 24, Figure 25, and Figure 26.

Updated Table 22: Typical and maximum current consumption in Sleep

mode, and added Figure 27 and Figure 28.

Updated Table 23: Typical and maximum current consumptions in Stop

mode. Added Figure 29: Typical current consumption vs temperature

in Stop mode.

Updated Table 24: Typical and maximum current consumptions in

Standby mode and Table 25: Typical and maximum current

consumptions in VBAT mode.

Updated On-chip peripheral current consumption conditions and

Table 26: Peripheral current consumption.

Updated tWUSTDBY and tWUSTOP, and added Note 3 in Table 27: Low-

power mode wakeup timings.

Maximum fHSE_ext and minimum tw(HSE) values updated in Table 28:

High-speed external user clock characteristics.

Updated C and gm in Table 30: HSE 4-26 MHz oscillator

characteristics. Updated RF, I2, gm, and tsu(LSE) in Table 31: LSE

oscillator characteristics (fLSE = 32.768 kHz).

Added Note 1 and updated ACCHSI, IDD(HSI, and tsu(HSI) in Table 32:

HSI oscillator characteristics. Added Figure 34: ACCHSI versus

temperature.

Updated fLSI, tsu(LSI) and IDD(LSI) in Table 33: LSI oscillator

characteristics. Added Figure 35: ACCLSI versus temperature

Table 34: Main PLL characteristics: removed note 1, updated tLOCK,

jitter, IDD(PLL) and IDDA(PLL), added Note 2 for fPLL_IN minimum and

maximum values.

Table 35: PLLI2S (audio PLL) characteristics: removed note 1,

updated tLOCK, jitter, IDD(PLLI2S) and IDDA(PLLI2S), added Note 2 for

fPLLI2S_IN minimum and maximum values.

Added Note 1 in Table 36: SSCG parameters constraint.

Updated Table 37: Flash memory characteristics. Modified Table 38:

Flash memory programming and added Note 2 for tprog. Updated tprog

and added Note 1 in Table 39: Flash memory programming with VPP.

Modified Figure 39: Recommended NRST pin protection.

Updated Table 42: EMI characteristics and EMI monitoring conditions

in Section : Electromagnetic Interference (EMI)g. Added Note 2 related

to VESD(HBM)in Table 43: ESD absolute maximum ratings.

Updated Table 48: I/O AC characteristics.

Added Section 6.3.15: I/O current injection characteristics.

Modified maximum frequency values and conditions in Table 48: I/O

AC characteristics.

Updated tres(TIM) in Table 50: Characteristics of TIMx connected to the

APB1 domain. Modified tres(TIM) and fEXT Table 51: Characteristics of

TIMx connected to the APB2 domain.

Table 95. Document revision history (continued)

Date

Revision

Changes

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