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IO196NPB3 Datasheet(PDF) 122 Page - Microsemi Corporation |
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IO196NPB3 Datasheet(HTML) 122 Page - Microsemi Corporation |
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122 / 210 page  Package Pin Assignments 4- 6 R ev isio n 1 5 QN132 – Bottom View Notes: 1. The die attach paddle center of the package is tied to ground (GND). 2. Option corner pads come with this device and package combination. It is optional to tie them to ground or leave them floating. 3. The QN132 package is discontinued and is not available for ProASIC3 devices. For Package Manufacturing and Environmental information, visit the Resource Center at: http://www.microsemi.com/soc/products/solutions/package/docs.aspx. A37 A1 A12 A36 D4 D3 D1 D2 A25 A48 A24 A13 B34 B1 B11 B44 B22 B12 C31 C1 C10 B33 B23 C30 C21 C40 C20 C11 Optional Corner Pad (4x) Pin A1Mark |
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