TLE42994

General Product Characteristics

Data Sheet

13

Rev. 1.2, 2014-07-03

4.3

Thermal Resistance

Table 3

Thermal Resistance

Parameter

Symbol

Values

Unit

Note / Test Condition

Number

Min.

Typ.

Max.

TLE42994G (PG-DSO-8)

1) not subject to production test, specified by design

R

thJSP

–

–

60

K/W

measured to pin 5

P_4.3.1

Junction to Ambient1)

R

thJA

–

113

–

K/W

2) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

P_4.3.2

Junction to Ambient1)

R

thJA

–

185

–

K/W

FR4 1s0p board, footprint

3) Specified

R

P_4.3.3

Junction to Ambient1)

R

thJA

–

142

–

K/W

heatsink area on PCB3)

P_4.3.4

Junction to Ambient1)

R

thJA

–

136

–

K/W

heatsink area on PCB3)

P_4.3.5

TLE42994GM (PG-DSO-14)

Junction to Soldering Point1)

R

thJSP

–

–

30

K/W

measured to all GND pins

P_4.3.6

Junction to Ambient1)

R

thJA

–

63

–

K/W

FR4 2s2p board2)

P_4.3.7

Junction to Ambient1)

R

thJA

–

112

–

K/W

FR4 1s0p board, footprint

only3)

P_4.3.8

Junction to Ambient1)

R

thJA

–

73

–

K/W

heatsink area on PCB3)

P_4.3.9

Junction to Ambient1)

R

thJA

–

65

–

K/W

heatsink area on PCB3)

P_4.3.10

TLE42994E (PG-SSOP-14 exposed pad)

Junction to Case1)

R

thJC

–

10

–

K/W

–

P_4.3.11

Junction to Ambient1)

R

thJA

–

47

–

K/W

FR4 2s2p board2)

P_4.3.12

Junction to Ambient1)

R

thJA

–

140

–

K/W

FR4 1s0p board, footprint

only3)

P_4.3.13

Junction to Ambient1)

R

thJA

–

63

–

K/W

heatsink area on PCB3)

P_4.3.14

Junction to Ambient1)

R

thJA

–

53

–

K/W

heatsink area on PCB3)

P_4.3.15