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TAS5760LDAPR Datasheet(PDF) 61 Page - Texas Instruments |
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TAS5760LDAPR Datasheet(HTML) 61 Page - Texas Instruments |
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61 / 77 page  TAS5760L www.ti.com SLOS782B – JULY 2013 – REVISED SEPTEMBER 2015 Layout Guidelines (continued) 12.1.3.2.1 PCB Footprint and Via Arrangement The PCB footprint (also known as a symbol or land pattern) communicates to the PCB fabrication vendor the shape and position of the copper patterns to which the TAS5760L device will be soldered to. This footprint can be followed directly from the guidance in the package addendum at the end of this data sheet. It is important to make sure that the thermal pad, which connects electrically and thermally to the PowerPAD of the TAS5760L device, be made no smaller than what is specified in the package addendum. This ensures that the TAS5760L device has the largest interface possible to move heat from the device to the board. The via pattern shown in the package addendum provides an improved interface to carry the heat from the device through to the layers of the PCB, because small diameter plated vias (with minimally-sized annular rings) present a low thermal-impedance path from the device into the PCB. Once into the PCB, the heat travels away from the device and into the surrounding structures and air. By increasing the number of vias, as shown in Layout Example, this interface can benefit from improved thermal performance. NOTE Vias can obstruct heat flow if they are not constructed properly. • Remove thermal reliefs on thermal vias, because they impede the flow of heat through the via. • Vias filled with thermally conductive material are best, but a simple plated via can be used to avoid the additional cost of filled vias. • The drill diameter should be no more than 8mils in diameter. Also, the distance between the via barrel and the surrounding planes should be minimized to help heat flow from the via into the surrounding copper material. In all cases, minimum spacing should be determined by the voltages present on the planes surrounding the via and minimized wherever possible. • Vias should be arranged in columns, which extend in a line radially from the heat source to the surrounding area. This arrangement is shown in the Layout Example section. • Ensure that vias do not cut-off power current flow from the power supply through the planes on internal layers. If needed, remove some vias which are farthest from the TAS5760L device to open up the current path to and from the device. 12.1.3.2.1.1 Solder Stencil During the PCB assembly process, a piece of metal called a stencil on top of the PCB and deposits solder paste on the PCB wherever there is an opening (called an aperture) in the stencil. The stencil determines the quantity and the location of solder paste that is applied to the PCB in the electronic manufacturing process. In most cases, the aperture for each of the component pads is almost the same size as the pad itself. However, the thermal pad on the PCB is quite large and depositing a large, single deposition of solder paste would lead to manufacturing issues. Instead, the solder is applied to the board in multiple apertures, to allow the solder paste to outgas during the assembly process and reduce the risk of solder bridging under the device. This structure is called an aperture array, and is shown in the Layout Example section. It is important that the total area of the aperture array (the area of all of the small apertures combined) covers between 70% and 80% of the area of the thermal pad itself. Copyright © 2013–2015, Texas Instruments Incorporated Submit Documentation Feedback 61 Product Folder Links: TAS5760L |
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