STM32F756VG datasheet(204/228 Pages) STMICROELECTRONICS

Part #	STM32F756VG

Description	Up to 25 communication interfaces

PDF	228 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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204 / 228 page

Package information

STM32F756xx

204/228

DocID027589 Rev 4

Figure 86. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint

0.380

0.0150

A3(2)

0.025

0.0010

b(3)

0.220

0.250

0.280

0.0087

0.0098

0.0110

4.504

4.539

4.574

0.1773

0.1787

0.1801

5.814

5.849

5.884

0.2289

0.2303

0.2317

0.400

0.0157

4.000

0.1575

4.800

0.1890

0.2695

0.0106

0.5245

0.0206

aaa

0.100

0.0039

bbb

0.100

0.0039

ccc

0.100

0.0039

ddd

0.050

0.0020

eee

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Back side coating.

3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Table 115. WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip scale

package mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

STM32F756VG Datasheet(PDF) 204 Page - STMicroelectronics

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