STM32F303RE datasheet(168/173 Pages) STMICROELECTRONICS

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STM32F303xD STM32F303xE

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7.7

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 19: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

•

TA max is the maximum temperature in °C,

•ΘJA is the package junction-to- thermal resistance, in ° C/W,

•

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

•

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

7.7.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

7.7.2

Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the ordering

information scheme shown in Section 8: Part numbering.

Each temperature range suffix corresponds to a specific guaranteed temperature at

maximum dissipation and to a specific maximum junction temperature.

As applications do not commonly use the STM32F303xD/E at maximum dissipation, it is

useful to calculate the exact power consumption and junction temperature to determine

which temperature range is best suited to the application.

Table 99. Package thermal characteristics

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-

LQFP144 - 20 × 20 mm

°C/W

Thermal resistance junction-

UFBGA100 - 7 × 7 mm

Thermal resistance junction-

LQFP100 - 14 × 14 mm

Thermal resistance junction-

WLCSP100 - 0.4 mm pitch

Thermal resistance junction-

LQFP64 - 10 × 10 mm / 0.5 mm pitch

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