MC74VHC1G01

www.onsemi.com

2

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage

*0.5 to )7.0

V

DC Input Voltage

−0.5 to +7.0

V

DC Output Voltage

V

DC Input Diode Current

−20

mA

DC Output Diode Current

$20

mA

DC Output Sink Current, per Pin

25

mA

$25

mA

Storage Temperature Range

*65 to )150

°C

Lead Temperature, 1 mm from Case for 10 Seconds

260

°C

Junction Temperature Under Bias

)150

°C

Thermal Resistance

SC70−5/SC−88A (Note 1)

TSOP−5

350

230

°C/W

Power Dissipation in Still Air at 85

°C

SC70−5/SC−88A

TSOP−5

150

200

mW

MSL

Moisture Sensitivity

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

u2000

u200

N/A

V

Latchup Performance

$500

mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

5. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol

Characteristics

Min

Max

Unit

DC Supply Voltage

2.0

5.5

V

DC Input Voltage

0.0

5.5

V

DC Output Voltage

0.0

7.0

V

Operating Temperature Range

−55

+125

°C

Input Rise and Fall Time

0

0

100

20

ns/V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

DEVICE JUNCTION TEMPERATURE VERSUS

TIME TO 0.1% BOND FAILURES

Junction

Temperature

°C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 3. Failure Rate vs. Time Junction Temperature

TIME, YEARS