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OMAP3530ECUS Datasheet(PDF) 238 Page - Texas Instruments

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Part # OMAP3530ECUS
Description  Applications Processors
PDF  265 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OMAP3530ECUS Datasheet(HTML) 238 Page - Texas Instruments

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OMAP3530, OMAP3525
SPRS507H – FEBRUARY 2008 – REVISED OCTOBER 2013
www.ti.com
Table 6-123. MMC/SD/SDIO Timing Requirements – High-Speed MMC Mode(1) (2) (3) (4) (continued)
NO.
PARAMETER
1.15 V
1.0 V
UNIT
MIN
MAX
MIN
MAX
MMC/SD/SDIO Interface 1 (3.0 V IO)
MMC3 tsu(CMDV-CLKIH)
Setup time, mmc1_cmd valid before mmc1_clk
5.6
26
ns
rising clock edge
MMC4 tsu(CLKIH-CMDIV)
Hold time, mmc1_cmd valid after mmc1_clk
2.3
1.9
ns
rising clock edge
MMC7 tsu(DATxV-CLKIH)
Setup time, mmc1_datx valid before mmc1_clk
5.6
26
ns
rising clock edge
MMC8 tsu(CLKIH-DATxIV)
Hold time, mmc1_datx valid after mmc1_clk
2.3
1.9
ns
rising clock edge
MMC/SD/SDIO Interface 2
MMC3 tsu(CMDV-CLKIH)
Setup time, mmc2_cmd valid before mmc2_clk
5.6
26
ns
rising clock edge
MMC4 tsu(CLKIH-CMDIV)
Hold time, mmc2_cmd valid after mmc2_clk
2.3
1.9
ns
rising clock edge
MMC7 tsu(DATxV-CLKIH)
Setup time, mmc2_datx valid before mmc2_clk
5.6
26
ns
rising clock edge
MMC8 tsu(CLKIH-DATxIV)
Hold time, mmc2_datx valid after mmc2_clk
2.3
1.9
ns
rising clock edge
MMC/SD/SDIO Interface 3
MMC3 tsu(CMDV-CLKIH)
Setup time, mmc3_cmd valid before mmc3_clk
5.6
26
ns
rising clock edge
MMC4 tsu(CLKIH-CMDIV)
Hold time, mmc3_cmd valid after mmc3_clk
2.3
1.9
ns
rising clock edge
MMC7 tsu(DATxV-CLKIH)
Setup time, mmc3_datx valid before mmc3_clk
5.6
26
ns
rising clock edge
MMC8 tsu(CLKIH-DATxIV)
Hold time, mmc3_datx valid after mmc3_clk
2.3
1.9
ns
rising clock edge
Table 6-124. MMC/SD/SDIO Switching Characteristics – High-Speed MMC Mode(1)
N O.
PARAMETER
1.15 V
1.0 V
UNIT
MIN
MAX
MIN
MAX
High-Speed MMC Mode
1/MMC
1/tc(clk)
Frequency(2), mmcx_ clk (3)
48
24
MHz
1
MMC2
tW(clkH)
Typical pulse duration, output clk high
X(4)*PO(5)
X(4)*PO(5)
ns
MMC2
tW(clkL)
Typical pulse duration, output clk low
Y(6)*PO(5)
Y(6)*PO(5)
ns
tdc(clk)
Duty cycle error, output clk
1041.7
2083.3
ps
tj(clk)
Jitter standard deviation(3), output clk
200
200
ps
MMC/SD/SDIO Interface 1 (1.8 V IO)
tc(clk)
Rise time, output clk
3
3
ns
tW(clkH)
Fall time, output clk
3
3
ns
tW(clkL)
Rise time, output data
3
3
ns
tdc(clk)
Fall time, output data
3
3
ns
MMC5
td(CLKOH-CMD)
Delay time, mmc1_clk rising clock edge to
3.7
14.1
4.1
34.5
ns
mmc1_cmd transition
(1)
In datx, x is equal to 1, 2, 3, 4, 5, 6, or 7.
(2)
Related with the output clk maximum and minimum frequencies programmable in I/F module.
(3)
In mmcx_clk, 'x' is equal to 1, 2, or 3.
(4)
The X parameter is defined as shown in Table 6-125.
(5)
PO = output clk period in ns.
(6)
The Y parameter is defined as shown in Table 6-126.
238
TIMING REQUIREMENTS AND SWITCHING CHARACTERISTICS
Copyright © 2008–2013, Texas Instruments Incorporated
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