STM32L151XE datasheet(106/134 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32L151xE STM32L152xE

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DocID025433 Rev 8

Figure 29. Maximum dynamic current consumption on VREF+ supply pin during ADC

conversion

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 11. The applicable

procedure depends on whether VREF+ is connected to VDDA or not. The 100 nF capacitors

should be ceramic (good quality). They should be placed as close as possible to the chip.

ADC clock

Sampling (n cycles)

Conversion (12 cycles)

Iref+

300µA

700µA

MS36686V1

Table 57. Maximum source impedance RAIN max(1)

(µs)

RAIN max (kΩ)

Ts (cycles)

fADC=16 MHz(2)

Multiplexed channels

Direct channels

2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V

0.25

Not allowed

0.7

Not allowed

0.5625

0.8

Not allowed

2.0

1.0

2.0

0.8

4.0

3.0

1.5

3.0

1.8

6.0

4.5

6.8

4.0

15.0

10.0

15.0

10.0

30.0

20.0

32.0

25.0

50.0

40.0

192

50.0

384

1. Guaranteed by design.

2. Number of samples calculated for fADC = 16 MHz. For fADC = 8 and 4 MHz the number of sampling cycles can be reduced

with respect to the minimum sampling time Ts (µs),

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